Package Engineering Technician job opportunity at Intel.

Home Jobs In Malaysia Tag: Job Package Engineering Technician position at Intel


DatePosted 13 Days Ago bot
Intel Package Engineering Technician
Experience: 2-years
Pattern: full-time
Country:
apply Apply Now
Salary:
Status:

Job

Copy Link Report
degreeAssociate
loacation Malaysia, Kulim, Malaysia
loacation Malaysia, Kuli..........Malaysia

Job Details: Job Description:  Engineer Technician plays a critical role supports the development of printed circuit board assembly (PCBA) processes and/or equipment for assembly packaging platform technologies to meet quality, reliability, cost, yield, productivity, and manufacturability requirements. In this role, you performs functions associated with board manufacturing (PCBA) including build readiness, system configuration, inventory- direct and indirect material management, material/product handling and equipment operation. Prepare direct material (BOM), indirect material (assembly jig and fixture, label and other required material for board manufacturing build. Raise purchase request of assembly jig fixture, indirect material (Spare, chemical, packaging, other consumerable part), label etc per system trigger or task given assigned. Responsible to monitor inventory of direct and indirect material to ensure availability to support build. Timely trigger disposition from required stakeholders of aged or unused material or indirect material. Responsible to operate equipment assigned, conduct data collection and PM as need. Responsible for running build in a qualitative way. This role best suit to who is detail oriented, self-starter with the ability to multitasks and continuous learning. Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates. Minimum Qualifications: Possess a diploma in Mechanical or Electronics or Computer Science or manufacturing OR possess Certificate of technical skills in equivalent technical field with 2 years in experience in Manufacturing/Lab operations OR 3 years in Manufacturing/Lab operations. Preferred Qualifications: 6+ months of experience in one or more of the following: Board assembly process/solder paste print/placement/reflow/XRay/inspection. IPC certification Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.            Job Type: Experienced Hire Shift: Shift 1 (Malaysia) Primary Location:  Malaysia, Kulim Additional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth. Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A Work Model for this Role This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change. * ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

Other Ai Matches

Process and Equipment Module Engineer (DIE Attach or Thermal Compress Bonding) Applicants are expected to have a solid experience in handling Job related tasks
Senior Gen AI Software Solutions Engineer Applicants are expected to have a solid experience in handling Job related tasks
Ethernet Networking Product Manager Applicants are expected to have a solid experience in handling Job related tasks
Signal and Power Integrity Engineer Applicants are expected to have a solid experience in handling Job related tasks
Data Analyst Engineer - Intern (Graduate) Applicants are expected to have a solid experience in handling Job related tasks
Graduate Talent (Pre-si System Validation) Applicants are expected to have a solid experience in handling Job related tasks
Director, Thin Film Development Applicants are expected to have a solid experience in handling Thin Film Development related tasks
GPU Design Verification Engineer Applicants are expected to have a solid experience in handling Job related tasks
Platform Performance Architect Applicants are expected to have a solid experience in handling Job related tasks
Graduate Talent (Physical Design) Applicants are expected to have a solid experience in handling Job related tasks
Senior Photonic-Integrated-Circuit Engineer Applicants are expected to have a solid experience in handling Job related tasks
Platform Power and Performance Architect Applicants are expected to have a solid experience in handling Job related tasks
AI Algorithm Research Intern – Neuromorphic Computing Applicants are expected to have a solid experience in handling Job related tasks
Module Development Engineer Applicants are expected to have a solid experience in handling Job related tasks
Logistics Operations Manager Applicants are expected to have a solid experience in handling Job related tasks
Security Architect Applicants are expected to have a solid experience in handling Job related tasks
Performannce Architect Intern Applicants are expected to have a solid experience in handling Job related tasks
Supply Chain GSCO CoE Process Automation Program Manager Applicants are expected to have a solid experience in handling Job related tasks
Project Controls Engineer (PCE) Applicants are expected to have a solid experience in handling Job related tasks
Learning and Development Consultant Applicants are expected to have a solid experience in handling Job related tasks
Post-silicon Validation and Debug Engineer Applicants are expected to have a solid experience in handling Job related tasks
Sr. Foundry Technologist - Process Integration Applicants are expected to have a solid experience in handling Job related tasks
AI Software Engineering Intern Applicants are expected to have a solid experience in handling Job related tasks