Process and Equipment Module Engineer (DIE Attach or Thermal Compress Bonding) job opportunity at Intel.

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DatePosted 30+ Days Ago bot
Intel Process and Equipment Module Engineer (DIE Attach or Thermal Compress Bonding)
Experience: 2-years
Pattern: full-time
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loacation Malaysia, Kulim, Malaysia
loacation Malaysia, Kuli..........Malaysia

Job Details: Job Description:  This role requires regular onsite presence to fulfill essential job responsibilities. Owns critical high volume manufacturing equipment and processes that enable rapid device miniaturization and the mass production of integrated circuits. Conducts tests and measurements of their operations to ensure control over critical dimensions and defectivity of the process line. Recommends and implements modifications for operating the equipment in order to improve production efficiencies, manufacturing techniques and optimizing production output for existing products, to meet safety, quality and cost indicator goals. Grows insitu manufacturing capacity to high volumes to demonstrate the technology capability while simultaneously transferring the technology to counterparts in manufacturing sites across the globe. Owns execution of maintenance and repair activities for equipment and relevant module of components. Initiates and owns the continuous improvement of equipment and process for key performance indicators (e.g., safety, quality, cost, productivity, defects, and yield) and works with equipment suppliers as required. Owns process development line items aligned to high volume process nodes. Participates in the transfer of technology to other sites through training and audit of installation and qualification outcomes to ensure matched processing across sites. Owns development and optimization of excursion prevention systems for the equipment and process. Owns detection of discrepant material or activities of the equipment and process. During factory ramps, owns equipment install/conversion and qualification to ensure tools are installed safely and on schedule, while meeting all quality/matching criteria (from design through Safety Level 1 and Safety Level Supplier milestones, Intel qual and manufacturing readiness processes). Qualifications: Minimum Qualifications: Bachelor's degree in Materials/Mechanical/Chemical/Electrical Engineering or related field. At least 2 years hands-on experience in die attach/TCB, flipchip, or semiconductor assembly process. Strong knowledge of Cu pillar/microbump metallurgy, wetting, thermomechanical behavior, and finepitch alignment. Proficiency in SPC and datadriven problem solving. Experience with metrology analytics. ex: Xray, warpage measurement, optical inspection (AOI), microscopy. Ability to work in Class 10k-100k cleanroom with PPE. " Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to our staffing team at  malaysia.staffing@intel.com . "            Job Type: Experienced Hire Shift: Shift 1 (Malaysia) Primary Location:  Malaysia, Kulim Additional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth. Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A Work Model for this Role This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

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