Director, Semiconductor IC Packaging & Assembly Engineering job opportunity at Renesas Electronics.



Date2026-06-03T08:48:02.710Z bot
Renesas Electronics Director, Semiconductor IC Packaging & Assembly Engineering
Experience: General
Pattern: Full-time
apply Apply Now
Salary:
Status:

Semiconductor IC Packaging & Assembly Engineering

Copy Link Report
degreeOND
loacation Shah Alam, Malaysia
loacation Shah Alam....Malaysia
Use ChatGPT Summary




No Job Summary Generated Yet.

Other Ai Matches

Sr Staff Application Engineer Applicants are expected to have a solid experience in handling Job related tasks
半導体デバイス・プロセス開発エンジニア Applicants are expected to have a solid experience in handling Job related tasks
Manager, Analog Design Applicants are expected to have a solid experience in handling Analog Design related tasks
Embedded Software Engineer Applicants are expected to have a solid experience in handling Job related tasks