(Sr.) Staff Package Design Engineer - MIS substrate/FC expose die (Experienced in Power or Gan is requried) job opportunity at Renesas Electronics.



Date2026-10-08 09:58:53.000000 bot
Renesas Electronics (Sr.) Staff Package Design Engineer - MIS substrate/FC expose die (Experienced in Power or Gan is requried)
Experience: Highly Experienced
Pattern: full-time
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Status:

Engineering · Semiconductors

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degreePhD
loacation Zhubei, , Taiwan, Taiwan
loacation Zhubei, , Taiw..........Taiwan




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Posting age not verified Jobserver status: Scraped Posted label: 2026-10-08 09:58:53.000000

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(Sr.) Staff Package Design Engineer - MIS substrate/FC expose die (Experienced in Power or Gan is requried) · Renesas Electronics

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